Rising pin holder
Customized production tailored to your needs! Used in the die bonding process during semiconductor manufacturing.
The "Uplift Pin Holder" is used in the die bonding process during semiconductor manufacturing to pick up chips from the dicing tape. It can maintain needle verticality, with a needle height variation within ±25μ, and features a mechanism to prevent needle detachment. We can customize it according to your application, so please feel free to contact us. 【Features】 ■ Used to pick up chips from the dicing tape ■ Maintains needle verticality ■ Needle height variation within ±25μ ■ Prevents needle detachment *For more details, please refer to the related links or feel free to contact us.
- Company：タイショー
- Price：Other
